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  Datasheet File OCR Text:
 Semiconductor
SA1316
Chip LED Lamp
Features
* * * * 1.6mm(L)x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED
Applications
* * * * LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLA-9001-001
1
SA1316
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg
Ratings
70 25 50 4 -2580 -30100
Unit
mW mA mA V C C
* Soldering Temperature Tsol 240C for 5 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100C to 150C within 2 minutes Soldering 240C within 5 seconds Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V
Min
-
Typ
2.0 6 630 35 65 70
Max
2.8 10 -
Unit
V mcd nm nm uA deg
P IR
1/2 X Y
IF= 20mA
KLA-9001-001
2
SA1316
Characteristic Diagrams
Fig. 1 IF - VF Fig. 2 IV - IF
Forward Current IF [mA]
Forward Voltage VF [V]
Luminous Intensity Iv [mcd]
Forward Current IF [mA]
Fig. 3 IF - Ta
Fig.4 Spectrum Distribution
Current IF [mA]
Forward
Relative Intensity [%]
Ambient Temperature Ta []
Wavelength [nm]
Fig. 5-1 Radiation Diagram(X)
Fig. 5-2 Radiation Diagram(Y)
Relative Luminous Intensity Iv [%]
Relative Luminous Intensity Iv [%]
KLA-9001-001
3


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